View K7K3236T2C_179412.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

K7K3236T2C K7K3218T2C
1Mx36 & 2Mx18 DDRII+ CIO b2 SRAM
36Mb DDRII+ SRAM Specification
165 FBGA with Pb & Pb-Free
(RoHS compliant)
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office. 2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where Product failure couldresult in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply.
* Samsung Electronics reserves the right to change products or specification without notice.
-1-
Rev. 1.3 August 2008
K7K3236T2C K7K3218T2C
Document Title
1Mx36 & 2Mx18 DDRII+ CIO b2 SRAM
1Mx36-bit, 2Mx18-bit DDRTM II+ CIO b2 SRAM
Revision History
Rev. No. 0.0 0.1 0.2 0.3 0.4 History 1. Initial document. 1. Modify the READ/WRITE timing diagram 1. Add comment Pb Free and Industrial 1. Change Max of clock cycle time 1. Change DC Characteristics, Pin Capacitance and Thermal Resistance 1. Correct errors 1. Change Samsung JEDEC Code in ID REGISTER DEFINITION 1. Correct typo 1. Change ICC measure condition 2. Change programmable impedence output buffer operation 3. Add AC Timing Characteristics 1. Add AC/DC Parameter of 450MHz 1. Delete AC/DC Parameter of 450MHz Draft Date Nov. 25, 2005 Dec. 12, 2005 Mar. 03, 2006 Mar. 03. 2006 Apr. 25. 2006 Remark Advance Preliminary Preliminary Preliminary Preliminary
0.5 0.6 1.0 1.1
May. 03. 2006 Jun. 05, 2006 Aug. 23, 2006 Jan. 30, 2007
Preliminary Preliminary Final Final
1.2 1.3
Mar. 16, 2007 Aug. 27, 2008
Final Final
-2-
Rev. 1.3 August 2008
K7K3236T2C K7K3218T2C
1Mx36 & 2Mx18 DDRII+ CIO b2 SRAM
1Mx36-bit, 2Mx18-bit DDRII CIO b2 SRAM
FEATURES
* 1.8V+0.1V/-0.1V Power Supply. * DLL circuitry for wide output data valid window and future freguency scaling. * I/O Supply Voltage 1.5V+0.1V/-0.1V * Pipelined, double-data rate operation. * Common data input/output bus . * HSTL I/O * Full data coherency, providing most current data. * Synchronous pipeline read with self timed late write. * Read latency : 2 clock cycles * Registered address, control and data input/output. * DDR(Double Data Rate) Interface on read and write ports. * Fixed 2-bit burst for both read and write operation. * Clock-stop supports to reduce current. * Two input clocks(K and K) for accurate DDR timing at clock rising edges only. * Two echo clocks (CQ and CQ) to enhance output data traceability. * Data Valid pin(QVLD) supported * Single address bus. * Byte write (x18, x36) function. * Simple depth expansion with no data contention. * Programmable output impedance(ZQ). * JTAG 1149.1 compatible test access port. * 165FBGA(11x15 ball aray FBGA) with body size of 15x17mm Organization X36 X18 Part Number K7K3236T2C-F(E)C(I)40 K7K3236T2C-F(E)C(I)33 K7K3218T2C-F(E)C(I)40 K7K3218T2C-F(E)C(I)33 Cycle Access Unit Time Time 2.5 3.0 2.5 3.0 0.45 0.45 0.45 0.45 ns ns ns ns
* -F(E)C(I) F(E) [Package type] : E-Pb Free, F-Pb C(I) [Operating Temperature] : C-Commercial, I-Industrial
FUNCTIONAL BLOCK DIAGRAM
36 (or 18) DATA REG
36 (or 18) 19 (or 20) WRITE/READ DECODE WRITE DRIVER 72 (or 36) SENSE AMPS 1Mx36 (2Mx18) MEMORY ARRAY 36 (or 18) OUTPUT REG
ADDRESS
19 (or 20)
OUTPUT SELECT
ADD REG
OUTPUT DRIVER
36 (or 18)
LD R/W BWX
DQ
QVLD CQ, CQ
4(or 2)
CTRL LOGIC
K K
(Echo Clock out)
CLK GEN SELECT OUTPUT CONTROL
Doff
Notes: 1. Numbers in ( ) are for x18 device
DDR SRAM and Double Data Rate comprise a new family of products developed by Cypress, Renesas, IDT, NEC and Samsung technology.
-3-
Rev. 1.3 August 2008
K7K3236T2C K7K3218T2C
1 A B C D E F G H J K L M N P R CQ NC NC NC NC NC NC Doff NC NC NC NC NC NC TDO 2 NC/SA* DQ27 NC DQ29 NC DQ30 DQ31 VREF NC NC DQ33 NC DQ35 NC TCK 3 SA DQ18 DQ28 DQ19 DQ20 DQ21 DQ22 VDDQ DQ32 DQ23 DQ24 DQ34 DQ25 DQ26 SA 4 R/W SA VSS VSS VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VSS VSS SA SA 5 BW2 BW3 SA VSS VSS VDD VDD VDD VDD VDD VSS VSS SA SA SA
1Mx36 & 2Mx18 DDRII+ CIO b2 SRAM
6 K K NC VSS VSS VSS VSS VSS VSS VSS VSS VSS SA QVLD NC 7 BW1 BW0 SA VSS VSS VDD VDD VDD VDD VDD VSS VSS SA SA SA 8 LD SA VSS VSS VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VSS VSS SA SA 9 SA NC NC NC NC NC NC VDDQ NC NC NC NC NC NC SA 10 NC/SA* NC DQ17 NC DQ15 NC NC VREF DQ13 DQ12 NC DQ11 NC DQ9 TMS 11 CQ DQ8 DQ7 DQ16 DQ6 DQ5 DQ14 ZQ DQ4 DQ3 DQ2 DQ1 DQ10 DQ0 TDI
PIN CONFIGURATIONS(TOP VIEW) K7K3236T2C(1Mx36)
Notes : 1. * Checked No Connect(NC) pins are reserved for higher density address, i.e. 10A for 72Mb, 2A for 144Mb . 2. BW0 controls write to DQ0:DQ8, BW1 controls write to DQ9:DQ17, BW2 controls write to DQ18:DQ26 and BW3 controls write to DQ27:DQ35.
PIN NAME
SYMBOL K, K QVLD CQ, CQ Doff SA DQ0-35 PIN NUMBERS 6B, 6A 6P 11A, 1A 1H 3A,9A,4B,8B,5C,7C,5N-7N,4P,5P,7P,8P,3R-5R,7R-9R 2B,3B,11B,3C,10C,11C,2D,3D,11D,3E,10E,11E,2F,3F 11F,2G,3G,11G,3J,10J,11J,3K,10K,11K,2L,3L,11L 3M,10M,11M,2N,3N,11N,3P,10P,11P 4A 8A 7B,7A,5A,5B 2H,10H 11H 5F,7F,5G,7G,5H,7H,5J,7J,5K,7K 4E,8E,4F,8F,4G,8G,3H,4H,8H,9H,4J,8J,4K,8K,4L,8L 4C,8C,4D-8D,5E-7E,6F,6G,6H,6J,6K,5L-7L, 4M-8M,4N,8N 10R 11R 2R 1R 2A,10A,1B,9B,10B,1C,2C,6C,9C,1D,9D,10D,1E,2E,9E, 1F,9F,10F,1G,9G,10G,1J,2J,9J,1K,2K,9K 1L,9L,10L,1M,2M,9M,1N,9N,10N,1P,2P,9P,6R DESCRIPTION Input Clock Q Valid output Output Echo Clock DLL Disable Address Inputs Data Inputs Outputs Read, Write Control Pin, Read active when high Synchronous Load Pin, bus Cycle sequence is to be defined when low Block Write Control Pin,active when low Input Reference Voltage Output Driver Impedance Control Input Power Supply ( 1.8 V ) Output Power Supply ( 1.5V ) Ground JTAG Test Mode Select JTAG Test Data Input JTAG Test Clock JTAG Test Data Output No Connect 2 1 NOTE
R/W LD BW0, BW1,BW2, BW3 VREF ZQ VDD VDDQ VSS TMS TDI TCK TDO NC
Notes: 1. When ZQ pin is directly connected to VDD output impedance is set to minimum value and it cannot be connected to ground or left unconnected. 2. Not connected to chip pad internally. 3. K, K can not be set to VREF voltage.
-4-
Rev. 1.3 August 2008
K7K3236T2C K7K3218T2C
1 A B C D E F G H J K L M N P R CQ NC NC NC NC NC NC Doff NC NC NC NC NC NC TDO 2 NC/SA* DQ9 NC NC NC DQ12 NC VREF NC NC DQ15 NC NC NC TCK 3 SA NC NC DQ10 DQ11 NC DQ13 VDDQ NC DQ14 NC NC DQ16 DQ17 SA 4 R/W SA VSS VSS VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VSS VSS SA SA 5 BW1 NC SA VSS VSS VDD VDD VDD VDD VDD VSS VSS SA SA SA
1Mx36 & 2Mx18 DDRII+ CIO b2 SRAM
6 K K NC VSS VSS VSS VSS VSS VSS VSS VSS VSS SA QVLD NC 7 NC BW0 SA VSS VSS VDD VDD VDD VDD VDD VSS VSS SA SA SA 8 LD SA VSS VSS VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VSS VSS SA SA 9 SA NC NC NC NC NC NC VDDQ NC NC NC NC NC NC SA 10 SA NC DQ7 NC NC NC NC VREF DQ4 NC NC DQ1 NC NC TMS 11 CQ DQ8 NC NC DQ6 DQ5 NC ZQ NC DQ3 DQ2 NC NC DQ0 TDI
PIN CONFIGURATIONS(TOP VIEW) K7K3218T2C(2Mx18)
Notes: 1. * Checked No Connect(NC) pins are reserved for higher density address, i.e. 2A for 72Mb. 2. BW0 controls write to DQ0:DQ8 and BW1 controls write to DQ9:DQ17.
PIN NAME
SYMBOL K, K QVLD CQ, CQ Doff SA DQ0-17 R/W LD BW0, BW1 VREF ZQ VDD VDDQ VSS TMS TDI TCK TDO NC PIN NUMBERS 6B, 6A 6P 11A, 1A 1H 3A,9A,10A,4B,8B,5C,7C,5N-7N,4P,5P,7P,8P,3R-5R,7R-9R 2B,11B,10C,3D,3E,11E,2F,11F,3G,10J,3K,11K,2L,11L 10M,3N,3P,11P 4A 8A 7B, 5A 2H,10H 11H 5F,7F,5G,7G,5H,7H,5J,7J,5K,7K 4E,8E,4F,8F,4G,8G,3H,4H,8H,9H,4J,8J,4K,8K,4L,8L 4C,8C,4D-8D,5E-7E,6F,6G,6H,6J,6K,5L-7L,4M-8M,4N,8N 10R 11R 2R 1R 2A,7A,1B,3B,5B,9B,10B,1C,2C,3C,6C,9C,11C,1D,2D,9D,10D 11D,1E,2E,9E,10E,1F,3F,9F,10F,1G,2G,9G,10G,11G 1J,2J,3J,9J,11J,1K,2K,9K,10K,1L,3L,9L,10L 1M,2M,3M,9M,11M,1N,2N,9N,10N,11N,1P,2P,9P,10P,6R DESCRIPTION Input Clock Q Valid output Output Echo Clock DLL Disable Address Inputs Data Inputs Outputs Read, Write Control Pin, Read active when high Synchronous Load Pin, bus Cycle sequence is to be defined when low Block Write Control Pin,active when low Input Reference Voltage Output Driver Impedance Control Input Power Supply ( 1.8 V ) Output Power Supply ( 1.5V ) Ground JTAG Test Mode Select JTAG Test Data Input JTAG Test Clock JTAG Test Data Output No Connect 2 1 NOTE
Notes: 1. When ZQ pin is directly connected to VDD output impedance is set to minimum value and it cannot be connected to ground or left unconnected. 2. Not connected to chip pad internally. 3. K, K can not be set to VREF voltage.
-5-
Rev. 1.3 August 2008
K7K3236T2C K7K3218T2C
GENERAL DESCRIPTION
1Mx36 & 2Mx18 DDRII+ CIO b2 SRAM
The K7K3236T2C and K7K3218T2C are 37,748,736-bits DDR Common I/O Synchronous Pipelined Burst SRAMs. They are organized as 1,048,576 words by 36bits for K7K3236T2C and 2,097,152 words by 18 bits for K7K3218T2C . Address, data inputs, and all control signals are synchronized to the input clock ( K or K ). Read data are referenced to echo clock ( CQ or CQ ) outputs. Read address and write address are registered on rising edges of the input K clocks. Common address bus is used to access address both for read and write operations. The internal burst counter is fixed to 2-bit sequential for both read and write operations. Synchronous pipeline read and late write enable high speed operations. Simple depth expansion is accomplished by using LD for port selection. Byte write operation is supported with BW0 and BW1 ( BW2 and BW3) pins for x18 ( x36 ) device. IEEE 1149.1 serial boundary scan (JTAG) simplifies monitoriing package pads attachment status with system. The K7K3236T2C and K7K3218T2C are implemented with SAMSUNG's high performance 6T CMOS technology and is available in 165pin FBGA packages. Multiple power and ground pins minimize ground bounce.
Read Operations
Read cycles are initiated by initiating R/W as high at the rising edge of the positive input clock K. Address is presented and stored in the read address register synchronized with K clock. For 2-bit burst DDR operation, it will access two 36-bit or 18-bit data words with each read command. The first pipelined data is transfered out of the device triggered by K clock rising edge. Next burst data is triggered by the rising edge of following K clock rising edge. Continuous read operations are initated with K clock rising edge. And pipelined data are transferred out of device on every rising edge of both K and K clocks. Initial read data latency is 2 clock cycles when DLL is on. When the LD is disabled after a read operation, the K7K3236T2C and K7K3218T2C will first complete burst read operation before entering into deselect mode at the next K clock rising edge. Then output drivers disabled automatically to high impedance state.
Write Operations
Write cycles are initiated by activating R/W as low at the rising edge of the positive input clock K. Address is presented and stored in the write address register synchronized with next K clock. For 2-bit burst DDR operation, it will write two 36-bit or 18-bit data words with each write command. The first "late writed" data is transfered and registered in to the device synchronous with next K clock rising edge. Next burst data is transfered and registered synchronous with following K clock rising edge. Continuous write operations are initated with K rising edge. And "late writed" data is presented to the device on every rising edge of both K and K clocks. When the LD is disabled, the K7K3236T2C and K7K3218T2C will enter into deselect mode. The device disregards input data presented on the same cycle R/W disabled. The K7K3236T2C and K7K3218T2C support byte write operations. With activating BW0 or BW1 ( BW2 or BW3 ) in write cycle, only one byte of input data is presented. In K7K3218T2C, BW0 controls write operation to D0:D8, BW1 controls write operation to D9:D17. And in K7K3236T2C, BW2 controls write operation to D18:D26, BW3 controls write operation to D27:D35.
-6-
Rev. 1.3 August 2008
K7K3236T2C K7K3218T2C
Depth Expansion
1Mx36 & 2Mx18 DDRII+ CIO b2 SRAM
Each port can be selected and deselected independently with R/W be shared among all SRAMs and provide a new LD signal for each bank. Before chip deselected, all read and write pending operations are completed.
Programmable Impedance Output Buffer Operation
The designer can program the SRAM's output buffer impedance by terminating the ZQ pin to VSS through a precision resistor(RQ). The allowable range of RQ is between 175and 350. The value of RQ (within 15%) is five times the output impedance desired. For example, 250 resistor will give an output impedance of 50. Impedance updates occur early in cycles that do not activate the outputs, such as deselect cycles. In all cases impedance updates are transparent to the user and do not produce access time "push-outs" or other anomalous behavior in the SRAM. To guarantee optimum output driver impedance after power up, the SRAM needs 1024 non-read cycles.
Output Valid Pin (QVLD)
The Q Valid indicates valid output data. QVLD is activated half cycle before the read data for the receiver to be ready for capturing the data. QVLD is edge aligned with CQ and CQ.
Echo clock operation
To assure the output tracibility, the SRAM provides the output Echo clock, pair of compliment clock CQ and CQ, which are synchronized with internal data output. Echo clocks run free during normal operation. The Echo clock is triggered by internal output clock signal, and transfered to external through same structures as output driver.
Power-Up/Power-Down Supply Voltage Sequencing
The following power-up supply voltage application is recommended: VSS, VDD, VDDQ, VREF, then VIN. VDD and VDDQ can be applied simultaneously, as long as VDDQ does not exceed VDD by more than 0.5V during power-up. The following power-down supply voltage removal sequence is recommended: VIN, VREF, VDDQ, VDD, VSS. VDD and VDDQ can be removed simultaneously, as long as VDDQ does not exceed VDD by more than 0.5V during power-down.
-7-
Rev. 1.3 August 2008
K7K3236T2C K7K3218T2C
1Mx36 & 2Mx18 DDRII+ CIO b2 SRAM
Detail Specification of Power-Up Sequence in DDRII+ SRAM
DDRII+ SRAMs must be powered up and initialized in a predefined manner to prevent undefined operations.
* Power-Up Sequence
1. Apply power and keep Doff at low state (All other inputs may be undefined) - Apply VDD before VDDQ - Apply VDDQ before VREF or the same time with VREF 2. Just after the stable power and clock(K,K), take Doff to be high. 3. The additional 2048 cycles of clock input is required to lock the DLL after enabling DLL * Notes: If you want to tie up the Doff pin to High with unstable clock, then you must stop the clock for a few seconds (Min. 30ns) to reset the DLL after it become a stable clock status.
* DLL Constraints
1. DLL uses K clock as its synchronizing input, the input should have low phase jitter which is specified as TK var. 2. The lower end of the frequency at which the DLL can operate is 120MHz. 3. If the incoming clock is unstable and the DLL is enabled, then the DLL may lock onto a wrong frequency and this may cause the failure in the initial stage.
Power up & Initialization Sequence (Doff pin controlled)
~ ~~
K,K
2048 cycle DLL Locking Range
Inputs Clock must be stable
Status
Power-Up
Unstable CLKstage
~ ~~
Any Command
VDD VDDQ VREF Doff
Power up & Initialization Sequence (Doff pin Fixed high, Clock controlled) ~~ ~
K,K
Min 30ns
~~
2048 cycle
~
~
Status VDD VDDQ VREF
Power-Up
Unstable CLKstage
~
Stop Clock
DLL Locking Range
Inputs Clock must be stable
Any Command
* Notes: When the operating frequency is changed, DLL reset should be required again. After DLL reset again, the minimum 2048 cycles of clock input is needed to lock the DLL.
-8-
Rev. 1.3 August 2008
K7K3236T2C K7K3218T2C
TRUTH TABLES
SYNCHRONOUS TRUTH TABLE
K Stopped LD X H L L R/W X X H L
1Mx36 & 2Mx18 DDRII+ CIO b2 SRAM
DQ DQ(A1) Previous state High-Z QOUT at K(t+2) Din at K(t+1) DQ(A2) Previous state High-Z QOUT at K(t+2) Din at K(t+1)
OPERATION Clock Stop No Operation Read Write
Notes: 1. X means "Dont Care". 2. The rising edge of clock is symbolized by ( ). 3. Before enter into clock stop status, all pending read and write operations will be completed.
WRITE TRUTH TABLE(x18)
K
Notes: 1. X means "Dont Care". 2. All inputs in this table must meet setup and hold time around the rising edge of input clock K or K ( ). 3. Assumes a WRITE cycle was initiated. 4. This table illustates operation for x18 devices.
K
BW0 L L L L H H H H
BW1 L L H H L L H H
OPERATION WRITE ALL BYTEs ( K ) WRITE ALL BYTEs ( K ) WRITE BYTE 0 ( K ) WRITE BYTE 0 ( K ) WRITE BYTE 1 ( K ) WRITE BYTE 1 ( K ) WRITE NOTHING ( K ) WRITE NOTHING ( K )
WRITE TRUTH TABLE(x36)
K
Notes: 1. X means "Dont Care". 2. All inputs in this table must meet setup and hold time around the rising edge of input clock K or K ( ). 3. Assumes a WRITE cycle was initiated.
K
BW0 L L L L H H H H H H
BW1 L L H H L L H H H H
BW2 L L H H H H L L H H
BW3 L L H H H H L L H H
OPERATION WRITE ALL BYTEs ( K ) WRITE ALL BYTEs ( K ) WRITE BYTE 0 ( K ) WRITE BYTE 0 ( K ) WRITE BYTE 1 ( K ) WRITE BYTE 1 ( K ) WRITE BYTE 2 and BYTE 3 ( K ) WRITE BYTE 2 and BYTE 3 ( K ) WRITE NOTHING ( K ) WRITE NOTHING ( K )
-9-
Rev. 1.3 August 2008
K7K3236T2C K7K3218T2C
ABSOLUTE MAXIMUM RATINGS
PARAMETER Voltage on VDD Supply Relative to VSS Voltage on VDDQ Supply Relative to VSS Voltage on Input Pin Relative to VSS Storage Temperature Operating Temperature Storage Temperature Range Under Bias
1Mx36 & 2Mx18 DDRII+ CIO b2 SRAM
SYMBOL VDD VDDQ VIN TSTG Commercial / Industrial TOPR TBIAS RATING -0.5 to 2.9 -0.5 to VDD -0.5 to VDD+0.3 -65 to 150 0 to 70 / -40 to 85 -10 to 85 UNIT V V V C C C
Note: 1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
OPERATING CONDITIONS (0C TA 70C)
PARAMETER Supply Voltage Reference Voltage Input Low Voltage(DC) Input Low Voltage(AC) Input High Voltage(AC)
2,3)
SYMBOL VDD VDDQ VREF VIL(DC) VIH(DC) VIL(AC) VIH(AC)
MIN 1.7 1.4 0.7 -0.3 VREF + 0.1 VREF + 0.2
TYP 1.8 1.5 0.75 -
MAX 1.9 1.6 0.8 VREF - 0.1 VDDQ + 0.3 VREF - 0.2 -
UNIT V V V V V V V
Input High Voltage(DC) 2,4)
6,7) 6,7)
Note: 1. VDDQ must not exceed VDD during normal operation. 2. These are DC test criteria. DC design criteria is VREF50mV. The AC VIH/VIL levels are defined separately for measuring timing parameters. 3. VIL (Min)DC=-0.3V, VIL (Min)AC=-1.5V(pulse width 3ns). 4. VIH (Max)DC=VDDQ+0.3V, VIH (Max)AC=VDDQ+0.85V(pulse width 3ns). 5. Overshoot : VIH (AC) VDDQ+0.5V for t 50% tKHKH(MIN). Undershoot : VIL (AC) VSS-0.5V for t 50% tKHKH(MIN). 6. This condition is for AC function test only, not for AC parameter test. 7. To maintain a valid level, the transitioning edge of the input must : a) Sustain a constant slew rate from the current AC level through the target AC level, VIL(AC) or VIH(AC) b) Reach at least the target AC level c) After the AC target level is reached, continue to maintain at least the target DC level, VIL(DC) or VIH(DC)
- 10 -
Rev. 1.3 August 2008
K7K3236T2C K7K3218T2C
PARAMETER Input Leakage Current Output Leakage Current Operating Current (x36): DDR Operating Current (x18): DDR Standby Current(NOP): DDR Output High Voltage Output Low Voltage Output High Voltage Output Low Voltage SYMBOL IIL IOL ICC ICC ISB1 VOH1 VOL1 VOH2 VOL2 IOH=-1.0mA IOL=1.0mA
1Mx36 & 2Mx18 DDRII+ CIO b2 SRAM
TEST CONDITIONS VDD=Max ; VIN=VSS to VDDQ Output Disabled, VDD=Max , IOUT=0mA Cycle Time tKHKH Min VDD=Max , IOUT=0mA Cycle Time tKHKH Min Device deselected, IOUT=0mA, f=Max, All Inputs0.2V or VDD-0.2V -40 -33 -40 -33 -40 -33 MIN -2 -2 MAX +2 +2 900 800 900 700 350 300 mA V V V V UNIT NOTES A A mA mA 1,4 1,4 1,5 2,6 2,6 3 3
DC ELECTRICAL CHARACTERISTICS (VDD=1.8V 0.1V, TA=0C to +70C)
VDDQ/2-0.12 VDDQ/2+0.12 VDDQ/2-0.12 VDDQ/2+0.12 VDDQ-0.2 VSS VDDQ 0.2
Notes: 1. Minimum cycle. IOUT=0mA. 2. |IOH|=(VDDQ/2)/(RQ/5)15% for 175 RQ 350. |IOL|=(VDDQ/2)/(RQ/5)15% for 175 RQ 350. 3. Minimum Impedance Mode when ZQ pin is connected to VDD. 4. Operating current is calculated with 100% read cycles or 100% write cycles. 5. Standby Current is only after all pending read and write burst opeactions are completed. 6. Programmable Impedance Mode.
- 11 -
Rev. 1.3 August 2008
K7K3236T2C K7K3218T2C
1Mx36 & 2Mx18 DDRII+ CIO b2 SRAM
AC TIMING CHARACTERISTICS (VDD=1.8V0.1V, TA=0C to +70C)
PARAMETER Clock Clock Cycle Time (K, K) Clock Phase Jitter (K, K) Clock High Time (K, K) Clock Low Time (K, K)
Clock to Clock (K K)
SYMBOL
-40 MIN 2.5 0.4 0.4 1.06 2048 30 0.45 -0.45 0.45 -0.45 0.2 -0.2 0.86 0.45 -0.45 -0.2 0.40 0.40 0.28 0.40 0.40 0.28 0.2 -0.45 -0.2 0.40 0.40 0.28 0.40 0.40 0.28 -0.2 1.1 -0.45 -0.45 MAX 8.4 0.20 0.4 0.4 1.3 2048 30 MIN 3.0
-33 MAX 8.4 0.20
UNIT
NOTE
tKHKH tK var tKHKL tKLKH tKHKH tK lock tK reset tKHQV tKHQX tKHCQV tKHCQX tCQHQV tCQHQX tCQHCQH tKHZ tKLZ tQVLD tAVKH tIVKH tDVKH tKHAX tKHIX tKHDX
ns ns ns ns ns cycle ns 5 4
DLL Lock Time (K) K Static to DLL reset Output Times K, K High to Output Valid K, K High to Output Hold K, K High to Echo Clock Valid K, K High to Echo Clock Hold CQ, CQ High to Output Valid CQ, CQ High to Output Hold CQ High to CQ High K, K High to Output High-Z K, K High to Output Low-Z CQ, CQ High to QVLD Valid Setup Times Address valid to K rising edge Control inputs valid to K rising edge Data-in valid to K, K rising edge Hold Times K rising edge to address hold K rising edge to control inputs hold K, K rising edge to data-in hold
0.45 0.45 0.2
ns ns ns ns ns ns ns 6
0.45 0.2
ns ns ns ns ns ns ns ns ns 2
Notes: 1. All address inputs must meet the specified setup and hold times for all latching clock edges. 2. Control signals are R/ W and LD. However BWx does not apply to this parameters. BWx signals obey the data setup and hold times. 3. To avoid bus contention, at a given voltage and temperature tKLZ is bigger than tKHZ. The specs as shown do not imply bus contention because tKLZ is a MIN parameter that is worst case at totally different test conditions (0C, 1.9V) than tKHZ, which is a MAX parameter(worst case at 70C, 1.7V) It is not possible for two SRAMs on the same board to be at such different voltage and temperature. 4. Clock phase jitter is the variance from clock rising edge to the next expected clock rising edge. 5. Vdd slew rate must be less than 0.1V DC per 50 ns for DLL lock retention. DLL lock time begins once Vdd and input clock are stable. 6. This parameter is extrapolated from the input timing parameters (tKHKH - 200ps where 200ps is the internal jitter.) This parameter is only guaranteed by design and not tested in production.
- 12 -
Rev. 1.3 August 2008
K7K3236T2C K7K3218T2C
THERMAL RESISTANCE
PRMETER Junction to Ambient Junction to Case Junction to Pins
1Mx36 & 2Mx18 DDRII+ CIO b2 SRAM
SYMBOL JA JC JB TYP 20.8 2.3 4.3 Unit NOTES
C/W C/W C/W
Note: Junction temperature is a function of on-chip power dissipation, package thermal impedance, mounting site temperature and mounting site thermal impedance. TJ=TA + PD x JA
PIN CAPACITANCE
PRMETER Address Control Input Capacitance Input and Output Capacitance Clock Capacitance
2. Periodically sampled and not
SYMBOL CIN COUT CCLK
TESTCONDITION VIN=0V VOUT=0V -
TYP 3.5 4 3
MAX 4 5 4
Unit pF pF pF
NOTES
Note: 1. Parameters are tested with RQ=250 and VDDQ=1.5V.
AC TEST CONDITIONS
Parameter Core Power Supply Voltage Output Power Supply Voltage Input High/Low Level Input Reference Level Input Rise/Fall Time Output Timing Reference Level
Note: Parameters are tested with RQ=250
AC TEST OUTPUT LOAD
Symbol VDD VDDQ VIH/VIL VREF TR/TF Value 1.7~1.9 1.4~1.6 1.25/0.25 0.75 0.3/0.3 VDDQ/2 Unit V V V V ns V
VREF 0.75V
VDDQ/2 50 Zo=50
SRAM
ZQ 250
- 13 -
Rev. 1.3 August 2008
K7K3236T2C K7K3218T2C
APPLICATION INRORMATION
1Mx36 & 2Mx18 DDRII+ CIO b2 SRAM
R=250 SRAM#1 Vt R
DQ Address R/W LD BW R Vt
R=250 SRAM#4 ZQ CQ CQ DQ KK
SA R/W LD0 BW0 BW1
ZQ CQ CQ DQ KK
SA R/WLD3BW0 BW1
MEMORY CONTROLLER
Return CLK Source CLK Return CLK Source CLK
R=50 Vt=VREF
SRAM1 Input CQ SRAM1 Input CQ SRAM4 Input CQ SRAM4 Input CQ
- 14 -
Rev. 1.3 August 2008
K7K3236T2C K7K3218T2C
1Mx36 & 2Mx18 DDRII+ CIO b2 SRAM
TIMING WAVE FORMS OF READ, WRITE AND NOP
NOP
READ
NOP 3
NOP 4
WRITE 5
READ
READ
NOP 8
NOP 9
NOP
(Note3)
WRITE 11
WRITE 12
1
2
6
7
10
K
tKHKL tKHKH tKHKH
K
tIVKH tKLKH tKHIX
LD
R/W
SA
A1 tQVLD
A2
A3
A4
A5
A6
QVLD
tKHQV tKHQX
D2-1 D2-2 Q3-1 Q3-2 Q4-1 Q4-2 D5-1 D5-2
DQ
Q1-1
Q1-2
tKHCQV
tCQHQV
CQ
CQ
DONT CARE
UNDEFINED
NOTE 1. Q1-1 refers to output from address A1. Q1-2 refers to output from the next internal burst address following A, etc. 2. Outputs are disabled(High-Z) two clock cycle after a NOP . 3. Two NOP cycle is the mandatory and 3rd NOP cycle is not necessary for correct DDRII+ READ/WRITE operation. However at high clock frequencies, considering the delay of real system board condition, it may be required to prevent bus contention.
- 15 -
Rev. 1.3 August 2008
K7K3236T2C K7K3218T2C
1Mx36 & 2Mx18 DDRII+ CIO b2 SRAM
IEEE 1149.1 TEST ACCESS PORT AND BOUNDARY SCAN-JTAG
This part contains an IEEE standard 1149.1 Compatible Test Access Port(TAP). The package pads are monitored by the Serial Scan circuitry when in test mode. This is to support connectivity testing during manufacturing and system diagnostics. Internal data is not driven out of the SRAM under JTAG control. In conformance with IEEE 1149.1, the SRAM contains a TAP controller, Instruction Register, Bypass Register and ID register. The TAP controller has a standard 16-state machine that resets internally upon power-up, therefore, TRST signal is not required. It is possible to use this device without utilizing the TAP. To disable the TAP controller without interfacing with normal operation of the SRAM, TCK must be tied to VSS to preclude mid level input. TMS and TDI are designed so an undriven input will produce a response identical to the application of a logic 1, and may be left unconnected. But they may also be tied to VDD through a resistor. TDO should be left unconnected.
JTAG Block Diagram
JTAG Instruction Coding
IR2 IR1 IR0 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 Instruction EXTEST IDCODE SAMPLE-Z RESERVED SAMPLE RESERVED RESERVED BYPASS TDO Output Boundary Scan Register Identification Register Boundary Scan Register Do Not Use Boundary Scan Register Do Not Use Do Not Use Bypass Register Notes 1 3 2 6 5 6 6 4
SRAM CORE
TDI
BYPASS Reg. Identification Reg. Instruction Reg. Control Signals
TDO
TMS TCK
TAP Controller
NOTE : 1. Places DQs in Hi-Z in order to sample all input data regardless of other SRAM inputs. This instruction is not IEEE 1149.1 compliant. 2. Places DQs in Hi-Z in order to sample all input data regardless of other SRAM inputs. 3. TDI is sampled as an input to the first ID register to allow for the serial shift of the external TDI data. 4. Bypass register is initiated to VSS when BYPASS instruction is invoked. The Bypass Register also holds serially loaded TDI when exiting the Shift DR states. 5. SAMPLE instruction dose not places DQs in Hi-Z. 6. This instruction is reserved for future use.
TAP Controller State Diagram
1 0 Test Logic Reset 0 Run Test Idle
1 1
Select DR 0 Capture DR 0 Shift DR 1 Exit1 DR 0 Pause DR 1 Exit2 DR 1 Update DR 0
1 1
Select IR 0 Capture IR
1
0
0 1 Shift IR 1 Exit1 IR 0 Pause IR 1 Exit2 IR 1 Update IR 1 0 0 0 0
1
0 0
1
- 16 -
Rev. 1.3 August 2008
K7K3236T2C K7K3218T2C
SCAN REGISTER DEFINITION
Part 1Mx36 2Mx18 Instruction Register 3 bits 3 bits
1Mx36 & 2Mx18 DDRII+ CIO b2 SRAM
Bypass Register 1 bit 1 bit ID Register 32 bits 32 bits Boundary Scan 109 bits 109 bits
ID REGISTER DEFINITION
Part 1Mx36 2Mx18 Revision Number (31:29) 000 000 Part Configuration (28:12) 00def0wx0t0q0b0s0 00def0wx0t0q0b0s0 Samsung JEDEC Code (11: 1) 00011001110 00011001110 Start Bit(0) 1 1
Note : Part Configuration /def=010 for 36Mb, /wx=11 for x36, 10 for x18 /t=1 for DLL Ver., 0 for non-DLL Ver. /q=1 for QDR, 0 for DDR /b=1 for 4Bit Burst, 0 for 2Bit Burst /s=1 for Separate I/O, 0 for Common I/O
BOUNDARY SCAN EXIT ORDER
ORDER 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 PIN ID 6R 6P 6N 7P 7N 7R 8R 8P 9R 11P 10P 10N 9P 10M 11N 9M 9N 11L 11M 9L 10L 11K 10K 9J 9K 10J 11J 11H 10G 9G 11F 11G 9F 10F 11E 10E ORDER 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 PIN ID 10D 9E 10C 11D 9C 9D 11B 11C 9B 10B 11A 10A 9A 8B 7C 6C 8A 7A 7B 6B 6A 5B 5A 4A 5C 4B 3A 2A 1A 2B 3B 1C 1B 3D 3C 1D ORDER 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 PIN ID 2C 3E 2D 2E 1E 2F 3F 1G 1F 3G 2G 1H 1J 2J 3K 3J 2K 1K 2L 3L 1M 1L 3N 3M 1N 2M 3P 2N 2P 1P 3R 4R 4P 5P 5N 5R Internal
Note: 1. NC pins are read as "X" ( i.e. dont care.)
- 17 -
Rev. 1.3 August 2008
K7K3236T2C K7K3218T2C
JTAG DC OPERATING CONDITIONS
Parameter Power Supply Voltage Input High Level Input Low Level Output High Voltage(IOH=-2mA) Output Low Voltage(IOL=2mA) Symbol VDD VIH VIL VOH VOL
1Mx36 & 2Mx18 DDRII+ CIO b2 SRAM
Min 1.7 1.3 -0.3 1.4 VSS
Typ 1.8 -
Max 1.9 VDD+0.3 0.5 VDD 0.4
Unit V V V V V
Note
Note: 1. The input level of SRAM pin is to follow the SRAM DC specification.
JTAG AC TEST CONDITIONS
Parameter Input High/Low Level Input Rise/Fall Time Input and Output Timing Reference Level
Note: 1. See SRAM AC test output load on page 11.
Symbol VIH/VIL TR/TF
Min 1.8/0.0 1.0/1.0 0.9
Unit V ns V
Note
1
JTAG AC Characteristics
Parameter TCK Cycle Time TCK High Pulse Width TCK Low Pulse Width TMS Input Setup Time TMS Input Hold Time TDI Input Setup Time TDI Input Hold Time SRAM Input Setup Time SRAM Input Hold Time Clock Low to Output Valid Symbol tCHCH tCHCL tCLCH tMVCH tCHMX tDVCH tCHDX tSVCH tCHSX tCLQV Min 50 20 20 5 5 5 5 5 5 0 Max 10 Unit ns ns ns ns ns ns ns ns ns ns Note
JTAG TIMING DIAGRAM
TCK
tCHCH tMVCH tCHMX
tCHCL
tCLCH
TMS
tDVCH tCHDX
TDI
tSVCH tCHSX
PI (SRAM)
tCLQV
TDO
- 18 -
Rev. 1.3 August 2008
K7K3236T2C K7K3218T2C
165 FBGA PACKAGE DIMENSIONS
1Mx36 & 2Mx18 DDRII+ CIO b2 SRAM
15mm x 17mm Body, 1.0mm Bump Pitch, 11x15 Ball Array
B
Top View
A C D
A G
Side View
E
B
F
Bottom View
H
E
Symbol A B C D
Value 15 0.1 17 0.1 1.3 0.1 0.35 0.05
Units mm mm mm mm
Note
Symbol E F G H
Value 1.0 14.0 10.0 0.5 0.05
Units mm mm mm mm
Note
- 19 -
Rev. 1.3 August 2008

▲Up To Search▲

Price & Availability of K7K3236T2C

	To Download K7K3236T2C Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .